The laser cutting machine is mainly used for separating and cutting FPC/PCBA/ fingerprint chips.

Automatic die attach equipment (ISLinDa) is mainly used to mount the chip on the substrate accurately, and the mounting accuracy X\Y is offset by ±0.015mm and θ±0.5°.

Wire Bonding equipment is mainly used to connect the chip and the substrate circuit by wire bonding.

The main function of AOI equipment is to detect the connection status of product gold wire, dirty chip surface and clean it.

The holder mount machine is mainly used to mount the lens assembly, VCM and HD on the substrate accurately, with the mounting accuracy of X\Y offset of ±0.015mm andθ±0.5°.

The AA equipment is mainly used for mounting VCM/ lens holder, adjusting the tilt angle of Lens θX θY θZ, and obtaining the best imaging quality of the product under the optical system.

It is a high-quality camera module and fingerprint module height setting device, which integrates multiple stations and is compatible with multiple functions.

It is a high-quality camera module burning device, which can test multiple products with one light source at the same time. It is a high-quality camera module testing equipment with multiple testing functions.

The eight-station automatic final inspection machine is a high-quality camera module testing equipment with multiple testing functions.

It is a high-quality camera module test equipment with multiple test functions.

It is a high-quality camera module test equipment with multiple test functions.

It is a high-quality camera module test equipment with multiple test functions.

The laser cutting machine is mainly used for separating and cutting FPC/PCBA/ fingerprint chips.

It is mainly used to impact the surface of materials, clean foreign matter to increase product surface fluidity.

It is mainly used to spot TPU glue, and the glue can be accurately and evenly spotted in the designated area by spraying glue.

Grab by vibrating TPU and PR identification, and accurately adhere to the designated position of FPC.

The TPU and the chip are fixed together by temperature and pressing up and down.

The high-definition CCD camera automatically scans the product to check the height defects of the product.