Shenzhen, November 14, 2025 — At today's "Global Chip Transformation, China's Chip Opportunities" Integrated Circuit CEO Exchange held at Longhua Shenghui City, Shenzhen SUNWIN Optoelectronics Technology Co., Ltd., a key enterprise in the park under SUNWIN Technology Group, showcased its high-end camera module products to participating experts and industrial chain partners, providing a solid application-side interpretation of the opportunities for "China's chips".

The event gathered industry leaders including Dr. Feng Mingxian, a national-level integrated circuit expert and President of the Asia-Pacific Chip Valley Institute of Technology. In his speech, Dr. Feng pointed out that China has occupied a pivotal position in the RISC-V ecosystem — a judgment that resonates with SUNWIN Technology's innovative practices. As the group's frontline hub for R&D, sales, and procurement, Shenzhen SUNWIN deeply recognizes that being rooted in Shenzhen, a fertile ground for innovation, is crucial for grasping industrial trends and aggregating top-tier resources.

During the on-site visit session, Shenzhen SUNWIN's R&D center became the focal point. The on-site displayed 8-megapixel automotive surround-view modules and next-generation under-display fingerprint solutions transformed abstract "chip opportunities" into tangible realities. These cutting-edge products, led by the Shenzhen team's R&D efforts, directly reflect the company's market-oriented rapid technology transformation capabilities.

As one of the over 60 high-quality enterprises introduced to Shenzhen Longhua Shenghui City Industrial Park, SUNWIN Technology was founded in Xianning, Hubei in 2011. It has laid out three production bases (in Tongcheng Xianning, Xianning High-Tech Zone, and Noida, India) and four R&D centers, covering a total area of over 350 mu (approximately 233,333 square meters), with more than 2,600 global employees and an annual output of over 200 million high-end camera modules. The company masters core technologies and processes such as CIB ultra-thin packaging, curved fingerprint recognition, underwater unlock fingerprint technology, TOF, and 3D structured light, holding more than 500 patents. Its products cover fields including mobile phones, laptops, automotive, medical care, security, drones, smart homes, and AR/VR. The on-site displayed 8-megapixel automotive surround-view modules and next-generation under-display fingerprint solutions made "China's chips" visible and tangible. As the RISC-V wave rises, the path of "specialization, refinement, characteristicization, and innovation" lies right at our feet!

This exchange not only highlighted SUNWIN Technology Group's dual-core driven strategic layout of "Hubei Manufacturing" and "Shenzhen Innovation" but also demonstrated its strength and determination in promoting the application of "China's chips" amid cutting-edge architectural transformations.