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Grand Groundbreaking Ceremony of SUNWIN Technology Group's Digital Intelligent Manufacturing Center (Tongcheng Base Phase III) Class 100 Cleanroom Project
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Grand Groundbreaking Ceremony of SUNWIN Technology Group's Digital Intelligent Manufacturing Center (Tongcheng Base Phase III) Class 100 Cleanroom Project

  • Categories:News
  • Author:SunWin Electronic
  • Origin:SunWin Electronic
  • Time of issue:2025-07-05 12:00
  • Views:

(Summary description)With an additional investment of 230 million yuan, the Digital Intelligent Manufacturing Center (Tongcheng Base Phase III) project will construct a high-standard cleanroom covering a total area of 32,000 square meters, including dynamic Class 100 and static Class 10 clean areas. The project will fully upgrade the COB automatic intelligent packaging production line, providing strong support for the capacity expansion of camera modules supporting global smartphones and intelligent terminals.

Grand Groundbreaking Ceremony of SUNWIN Technology Group's Digital Intelligent Manufacturing Center (Tongcheng Base Phase III) Class 100 Cleanroom Project

(Summary description)With an additional investment of 230 million yuan, the Digital Intelligent Manufacturing Center (Tongcheng Base Phase III) project will construct a high-standard cleanroom covering a total area of 32,000 square meters, including dynamic Class 100 and static Class 10 clean areas. The project will fully upgrade the COB automatic intelligent packaging production line, providing strong support for the capacity expansion of camera modules supporting global smartphones and intelligent terminals.

  • Categories:News
  • Author:SunWin Electronic
  • Origin:SunWin Electronic
  • Time of issue:2025-07-05 12:00
  • Views:
Information

The groundbreaking ceremony was hosted by He Qisan, Vice Chairman and Executive Vice President of SUNWIN Technology Group.

Liu Chuanlu, Chairman and President of SUNWIN Technology Group, delivered a speech.

Yang Qi, Deputy Secretary of Tongcheng County Party Committee and Secretary of the Working Committee of Tongcheng Economic and Technological Development Zone, delivered a congratulatory speech and announced the official groundbreaking of SUNWIN Technology's Digital Intelligent Manufacturing Center.

Group photo of guests and company management at the groundbreaking ceremony

With an additional investment of 230 million yuan, the Digital Intelligent Manufacturing Center (Tongcheng Base Phase III) project will construct a high-standard cleanroom covering a total area of 32,000 square meters, including dynamic Class 100 and static Class 10 clean areas. The project will fully upgrade the COB automatic intelligent packaging production line, providing strong support for the capacity expansion of camera modules supporting global smartphones and intelligent terminals.

Standing at a new historical starting point, SUNWIN Technology is accelerating its layout in cutting-edge fields such as AI vision, metaverse, artificial intelligence, and robotics with the courage of "reform re-launch". Guided by the determination of "second entrepreneurship", the Group is promoting strategic reforms, striving to optimize its product structure, seizing the high ground of "high-precision and advanced" intelligent imaging products, and achieving another leapfrog development of SUNWIN Technology.

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